HUBBELL PREMISE WIRING
Image of HBBBHR19KTTP Grounding & Bonding, Bus Bar, 0.75" x 19", 7D, Tin Plated
Image of HBBBHR19KTTP Grounding & Bonding, Bus Bar, 0.75" x 19", 7D, Tin Plated
Image of HBBBHR19KTTP Grounding & Bonding, Bus Bar, 0.75" x 19", 7D, Tin Plated
Image of HBBBHR19KTTP Grounding & Bonding, Bus Bar, 0.75" x 19", 7D, Tin Plated

Grounding & Bonding, Bus Bar, 0.75" x 19", 7D, Tin Plated

Brand: Hubbell Premise Wiring

Catalog ID: HBBBHR19KTTP

Grounding & Bonding, Bus Bar, 0.75" x 19",7D, Tin Plated

  • 0.75" x 19"
  • 7D
  • Tin Plated

Product details

General

Application

Kit

Catalog Number

HBBBHR19KTTP

Item Type

Busbars

Material

Tin-plated Copper

UPC

662620310909

Dimensions

Depth

19 in

Height

0.75 in

Thickness

0.25 in

Certifications And Compliance

Industry Standard(s)

TIA-607 Compliant, c-UL-us Listed

Resources and downloads

Sales Drawings

Customer Use Drawings